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Micron Technology, Inc. has targeted the ultra-thin computing market with reduced-height single-sided DDR3 DRAM modules and connector solutions. They are announcing availability of a single-sided SODIMM and a low-profile, single-sided, double data rate (DDR3) SODIMM connector solution from TE Connectivity. This new single-sided form factor will take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets, and other thin and light devices. Targeted to provide a reduced-height memory solution for the ultra-thin computing market, these new SODIMM modules will have components on either the front side or the backside of the module, but not both. When paired with TE Connectivity’s new single-sided DDR3 SODIMM connector, the total z-height of the combined module and connector is a mere 3mm. This represents a 35% size reduction compared to the 4.6mm z-height of a standard SODIMM module.
Micron’s new single-sided SODIMM is available as a 4GB, single rank, X8 configuration. In addition to the reduced height, the new module is built using 30nm DDR3LLLL-RS components that are less power-hungry in standby than standard DDR3. Also, these new single-sided SODIMMs are pin-to-pin compatible with present DDR3 modules, making them backwards-compatible with existing DDR3 SODIMM connectors.
Kris Kodo, Micron’s Director of Business Development, Computing Devices, states that “Given the depth and breadth of ultra-thin devices currently on the market, coupled with consumer demands for sleek, lightweight designs, Micron’s objective is to offer solutions that meet the specialized power, portability and battery life needs. Micron’s unique Single-Sided SODIMM form factor meets those requirements and leads the way for future developments in this growing segment.”
Single-Sided Module
TE Connectivity engineers have designed the new single-sided DDR3 SODIMM connector to be able to deliver peak performance with high-speed data usage. The connector features the aforementioned 35 % height reduction compared to similar low-profile connectors. This, in turn, reduces the height of the end product by 5-10%. It also reduces the motherboard shadow area by nearly 156 square mms, or 312 square mms for common dual-socket implementations. This new DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards, and is offered in both standard and reverse versions.
Standard Dual-Sided Module
According to Hook Chang, product manager with TE Consumer Devices, “It’s clear that we’re seeing devices, ranging from Ultrabook devices to tablets, become increasingly thinner and sleeker. In the past, the miniaturization of circuitry-powering device memory often compromised reliability. Our DDR3 SODIMM connector solves that problem, ensuring durable connectivity to optimize device functionality, speed and usability. Micron Technology shares our commitment to provide consumers with high-quality, reliable cost-effective solutions to maximize product performance.”
Single-Sided DDR3 SODIMM Features:
* 4GB, single-rank, X8 configuration
* Standard or reverse layout
* 2.6mm module z-height
* Pin-to-pin compatible with DDR3 SODIMMs
* Backward compatible with DDR3 SODIMM connectors
* Reduced z-height plus supply chain/design flexibility
* Standalone or used with onboard DRAM
* Available Spring 2013
Single-Sided SODIMM samples are available from Micron now, with mass production scheduled for Spring of 2013. The Single-Sided SODIMM samples are available from TE Connectivity now, with mass production scheduled for June of 2013. The Micron press release can be viewed here TE Connectivity’s product page for the new connector can be viewed here.